AURORA provides customer with a high quality & reliable thin film deposition. Magnetron sputtering sources are specially designed for maximum erosion rate.
AURORA offers a low risk manufacturing solution.

Application

• Dielectric layers(High K) and conductive electrodes for transistor gate and memory cell, passivation and diffusion barrier, seed layers(metal liners) and conductive layers for IC interconnection
  

Technology

• DC, reactive, RF-sputtering system
  
• Cathodes are DC / RF compatible
  
• Optimized magnetron source design for a high target utilization
  
• Substrate pretreatment by means of heating
  
• Simple & compact system design for small footprint
  
• User friendly control system
  

Specification

• 1 process chamber system
  
• 1 load lock chambers with standard wafer magazines
  
• Linear sample transfer
  
• Substrate dimensions up to 8"
  
• Substrate heating max. 900 °C
  
• Turbo molecular pump of high-vacuum pumping
• Booster & oil rotary combination pump of low-vacuum pumping system
  
• Auto pressure control with throttle valve
  
• Circular or rectangular type of sputter source
  
• Sputter power DC 300~3000W, RF generator 600W~3000W
  with 13.56MHz auto matching box
  
• Gas delivery module with mass flow controller
  
• Manual / PC, PLC control including Windows user interface
  for fully automatic process control