RF IPD
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- Category
- Other Computer Accessories
H&S HighTech Corp.
- Country / Year Established
-
South Korea
/
1998
- Business type
- Manufacturer
- Verified Certificate
-
16
| Product name | RF IPD | Certification | - |
|---|---|---|---|
| Category | Other Computer Accessories | Ingredients | - |
| Keyword | - | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Descriptions
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Telephus' TDP0918W203 is a high attenuation diplexer for dual band GSM/DCS or AMPS/PCS applications which is supplied as a bare die. The diplexer has low insertion loss in pass band and high rejection level in stop band. It is composed of 10 um Cu-plated inductors and Metal-insulator-metal capacitors, which are fabricated on Si Smart Substrate with 25 um thick oxide layer by Telephus' RFIPD (Integrated Passive Device) process. This product is very suitable for small-sized modules for wireless hand-held or body-worn applications.
Features
- Passive Integration on Si Smart Substrate
- Low insertion loss in pass band
- High attenuation in stop band
- Handles up to 3watts incident RF power
- Operating temperature: -40 to +85°C
- Storage temperature: -40 to +85°C
- Small size: 1.0mm x 1.0mm
- Low profile: 0.3mm typical
- Gold wire bonding compatible
- Applicable to MCM (Multi Chip Module)
- Packaged in reel, chip tray, or wafer
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Ilkwon Dong
- Address
- 25-11, Jang-dong, Yuseong-gu, Daejeon, 305-343, Korea
- Product Category
- Other Telecommunications Equipment
- Year Established
- 1998
- No. of Total Employees
- 1-50
- Company introduction
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Telephus Inc. is a venture corporation that develops, manufactures, and markets wireless telecommunication components with its own design capability and innovative smart substrate technology. The value of Telephus products is its breakthrough, patented manufacturing technology for smart silicon substrates, which creates demonstrable customer benefits in term of cost, function, and product reliability.
For instance, with a new concept of RF IC design (called "TR-Array") spun off from smart substrate technology, Telephus has received an award from ECTC, US, 2000 (sponsored by Motorola). Smart Substrate Technology provides outstanding cost benefit by integrating numerous passive components of GaAs (or SiGe) RF IC into a silicon substrate without any sacrifice of electrical property.
In addition, for diversified product lines in the semiconductor component industry, Telephus has developed an innovative ACF (Antistrophic Conductive Film: Advanced Electronic Package Material) showing significant improvement of T/C (Thermal Cycle) reliability of flip chip on organic substrates with lower CTE and higher modulus of NCF layer.
- Main Markets
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China
Hong Kong(China)
Japan
Malaysia
Philippines
- Main Product
