Descriptions

Telephus' TBL24C201 is a balun for Wireless LAN, Bluetooth applications which is supplied as wafer level CSP. The balun has low insertion loss in pass band and low amplitude and phase difference. It is composed of 10 um Cu-plated inductors and Metal-Insulator-Metal capacitors, which are fabricated on Si Smart Substrate with 25 um thick oxide layer by Telephus' RFIPD (Integrated Passive Device) process. The bump size and pitch of the balun are selected such that the device can be placed directly on PCB using the conventional surface mounting techniques. The solder bump contacts are a 63Sn/37Pb alloy or lead free and are nominally 0.30 mm in diameter.

Features

• Passive integration on Si Smart Substrate
  
• Low insertion loss in pass band
  
• Low amplitude and phase difference
  
• Operating temperature: -40 to +85 °C
  
• Storage temperature: -40 to +85 °C
  
• Small size: 1.2 mm ?1.85 mm
  
• Eutectic Sn/Pb or lead-free solder bump
  
• Ultra small footprint, 0.65 mm pitch
  
• Directly attachable on PCB
  
• Packaged in tape and reel

Electrical Specifications

Typical Characteristics

Typical Solder Reflow Thermal Profile (No Clean Flux)

Physical Dimensions

Notes:

• 63Sn/37Pb eutectic bump
  
• Recommend non-solder mask defined landing pad.
  
• Pin A1 is established by lower right corner with respect to text orientation. Remaining pins are numbered counter clockwise.

Land pattern Recommendation

Two types of land patterns are used for surface mount packages,

1. Non-solder mask defined (NSMD)
   
2. Solder mask defined (SMD)

Notes:

• NSMD configuration is preferred due to its tighter control on copper etch process and a reduction in the stress concentration points on the PCB side compared to SMD configuration.
  
• A copper layer thickness than 1 oz is recommended to achieve higher stand-off. A 1 oz. (30 micron) or greater copper thickness results in a lowering of the effective stand-off, which may compromise solder joint reliability.
  
• For the NSMD pad geometry, the trace width at the connection to the land pad should not exceed 2/3 of the pad diameter. The recommended pad geometry is shown in Table1.