RF IPD

RF IPD


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
Payment Terms
Negotiable
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
Category
Other Computer Accessories

H&S HighTech Corp.

Country / Year Established
South Korea South Korea / 1998
Business type
Manufacturer
Verified Certificate

16

TRADE TOWER

DUNS

Product name RF IPD Certification -
Category Other Computer Accessories Ingredients -
Keyword - Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -

Product Information

Descriptions

Telephus' TDL0918W302 is a dual LPF (low pass filter) for GSM/AMPS, DCS/PCS or other 900 MHz and 1800MHz applications which is supplied as a bare die. The dual LPF has low insertion loss in pass band and high attenuation in harmonics. It is composed of 10 um Cu-plated inductors and Metal-Insulator-Metal capacitors, which are fabricated on Si Smart Substrate with 25 um thick oxide layer by Telephus' RFIPD (Integrated Passive Device) process. This product is very suitable for small-size modules for wireless hand-held or body-worn applications.

Features

  • Passive Integration on Si Smart Substrate
  • Low insertion loss in pass band
  • High attenuation in harmonics
  • Low VSWR
  • Small size: 1.0mm x 1.2mm
  • Low profile: 0.3mm typical
  • Handles up to 3watts incident RF power
  • Operating temperature: -40 to +85°C
  • Storage temperature: -40 to +85°C
  • Gold wire bonding compatible
  • Applicable to MCM (Multi Chip Module)
  • Packaged in reel, chip tray, or wafer

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

H&S HighTech Corp.

Country / Year Established
South Korea South Korea / 1998
Business type
Manufacturer

16

TRADE TOWER

DUNS

President
Ilkwon Dong
Address
25-11, Jang-dong, Yuseong-gu, Daejeon, 305-343, Korea
Product Category
Other Telecommunications Equipment
Year Established
1998
No. of Total Employees
1-50
Company introduction

Telephus Inc. is a venture corporation that develops, manufactures, and markets wireless telecommunication components with its own design capability and innovative smart substrate technology. The value of Telephus products is its breakthrough, patented manufacturing technology for smart silicon substrates, which creates demonstrable customer benefits in term of cost, function, and product reliability.

For instance, with a new concept of RF IC design (called "TR-Array") spun off from smart substrate technology, Telephus has received an award from ECTC, US, 2000 (sponsored by Motorola). Smart Substrate Technology provides outstanding cost benefit by integrating numerous passive components of GaAs (or SiGe) RF IC into a silicon substrate without any sacrifice of electrical property.

In addition, for diversified product lines in the semiconductor component industry, Telephus has developed an innovative ACF (Antistrophic Conductive Film: Advanced Electronic Package Material) showing significant improvement of T/C (Thermal Cycle) reliability of flip chip on organic substrates with lower CTE and higher modulus of NCF layer.

Main Markets

China China

Hong Kong(China) Hong Kong(China)

Japan Japan

Malaysia Malaysia

Philippines Philippines

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