MAXIS DRIE Etcher
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- Category
- Other Machinery & Industry Equipment
GigaLane.co.Ltd
- Country / Year Established
-
South Korea
/
- Business type
- Others
- Verified Certificate
-
16
| Product name | MAXIS DRIE Etcher | Certification | - |
|---|---|---|---|
| Category | Other Machinery & Industry Equipment | Ingredients | - |
| Keyword | - | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Description
We are a specialized company of dry etcher with a long experience and engineering technique to develop, manufacture and provide various kinf of etching systems, that can satisfy various needs of customers, are being applied from semiconductor to MEMS, LED and R&D.
MAXISTM DRIE etcher is high density plasma etching equipment for 4~8inch deep silicon etching that has the superior capacity of performance available for highly difficulty and differentiated process, and can be applied not only TSV(Through Silicon Via) or WSP(Wafer Level Package) in the semi-conductor lines but process of MEMS that are being spotlighted recently.
Features
- Semiconductor, MEMS, Nano Chip, LED, Solar Cell, Opto-Electronics
- Process capability up to sub-micron feature size
- 4~8inch silicon wafer or polygonal SUB on Tray
- Advanced Multi ICP Source Coil(High Density Plasma)
- Multi Bias Source Power
- Specialized Magnetic Field(Charged Particle Control)
- Single Chamber for Etching or Ashing(cluster Type Available)
- Wafer to Wafer Full Automation(Semi Auto or Manual Type Available)
- Electrostatic Chuck or Mechanical Chuck(Tray type available)
- customizing Backbone
- Higher Performance with lower price
Applications
- Silicon Deep Trench Etch
- Silicon Through Etch
- Thin Nitride/Oxide Etch
- Poly Silicon Etch
- Ash
- R&D
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- KIM, JUNG YOUNG
- Address
- 1-1, Seoku-dong, , Hwaseong-si,Gyeonggi-do,
- Product Category
- Telecom Parts
- Company introduction
-
"MAX is MAXIS. Get to The max with MAXIS" MAXIS which designs and manufactures dry Etcher with a long experience and skill has been committed to developing and localizing etcher since 2000. We have forecasted the future of the market flow and emerging industry since 2nd beginning in 2008, and have engaged in developing a range of etching system through micro machinable device and semiconductor. Now MAXIS has the strong presence in the dry etcher market. Professionals for MAXIS are specialized in each etcher model and organized with strong stewardship. Semiconductor, LED and MEMS Etcher market are considered not to be opened to newcomers due to the technical gap with the predominator, MAXIS, however, overcame the difficulty by world class technology and know-how and has been well recognized in the market. Over the past years, we fostered our product to go to the market abroad, consequently we has made distributorship and strategic engagement with foreign companies to be a global best company, moreover we are working on the new bushiness field. MAXIS is focused on satisfying customer's need and raising its competitiveness, and tries to get various certificates, license agreements and patents. We strive to further strengthen our position, and desire to serve customers to the very best of our ability.
- Main Markets
-
China
Japan
- Factory Information
-
,
Microtech
- Main Product
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