Standard Magnetron Sputter with 4x3

Standard Magnetron Sputter with 4x3


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Required Quantity
Place of Origin
Payment Terms
Negotiable
Production method
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Shipping / Lead Time
Negotiable / Negotiable
Keyword
pvd, sputter, magnetron sputter
Category
Other Machinery & Industry Equipment

A-Tech System, Inc.

Country / Year Established
South Korea South Korea /
Business type
Others
Verified Certificate

12

DUNS

Product name Standard Magnetron Sputter with 4x3 Certification -
Category Other Machinery & Industry Equipment Ingredients -
Keyword pvd , sputter , magnetron sputter Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -

Product Information

Metal, ceramic, and alloy deposition for basic research in various fields.

Special Features

Deposition of metallic and inorganic layers is not only available, but partially applicable to organic materials deposition by adopting both rf and dc sources.
Multilayer and codeposition in up or down-sputtering mode can be selectively chosen.
Automatic loadlock system, which is compactly designed for space saving.
Optimized configurations of sputter gun and shutter for minimizing cross-contamination between installed targets.
Typical process data of various materials can be delivered on request.

Specifications

Wafer capacity : 4in wafer or 100mm x 100mm glass
Dimension : 1,720L x 1,835H x 1,080W (mm3)
Power : AC 220V, single or three phase
Gas : Ar/N2/O2
Pump: Rotary pump & turbomolecular pump
Heater : SiC heater 6" (Max. 600'C)
Substrate bias : RF or DC
Loadlock system : single wafer loading or cassette loading
System control : LabView-based PC control  

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

A-Tech System, Inc.

Country / Year Established
South Korea South Korea /
Business type
Others

12

DUNS

President
Cho, Young Sang
Address
175-25, Cheongcheon-Dong 2, Bupyeong-Gu, Incheon, 403-853, Rep. Korea
Product Category
Machinery & Parts
Company introduction

Developed itmes

- Ion beam source
- Arc source
- Filtered cathodic vacuum arc system and process
- LPCVD for nanotube synthesis
- Silica PECVD system
- UHV(Ultra High Vacuum) sputtering system
- Silica TCP (Transformer Coupled Plasma) etcher
- UHV-sputter system for ferromagnetic multilayers
- Vacuum arc system for nitrides deposition
- In-line system of vacuum arc deposition for protecting PDP
  electrodes
- High vacuum test system for a flat light source evaluation
- Multifunctional standard sputtering system for R&D
- NPPN(New Post Plasma Nitriding) System
- Sputter for polygon mirror applicable to laser printer
- Production scale of arc ion plating (AIP) system
- Ion beam sputter for precision optics
- Production scale of AIP and NPPN systems
- Ion plating system for various coloration
- Pilot scale of arc discharge equipment for CNT transparent electrode
  sputter web coater for flexible display research
- Sputter system for ophthalmic
- Polycrystalline silicon ingot growing equipment
- PECVD system for anti-reflective coatings on solar cell
- PECVD system for graphene deposition
- Al plasma nitriding equipment for mass production with KAITECH
- Equipment of carbon nanotube using electrical arc discharge method
- Graphene PECVD-PVD Cluster equipment

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