Standard Magnetron Sputter with 4x3
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- pvd, sputter, magnetron sputter
- Category
- Other Machinery & Industry Equipment
A-Tech System, Inc.
- Country / Year Established
-
South Korea
/
- Business type
- Others
- Verified Certificate
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12
| Product name | Standard Magnetron Sputter with 4x3 | Certification | - |
|---|---|---|---|
| Category | Other Machinery & Industry Equipment | Ingredients | - |
| Keyword | pvd , sputter , magnetron sputter | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Metal, ceramic, and alloy deposition for basic research in various fields.
Special Features
Deposition of metallic and inorganic layers is not only available, but partially applicable to organic materials deposition by adopting both rf and dc sources.
Multilayer and codeposition in up or down-sputtering mode can be selectively chosen.
Automatic loadlock system, which is compactly designed for space saving.
Optimized configurations of sputter gun and shutter for minimizing cross-contamination between installed targets.
Typical process data of various materials can be delivered on request.
Specifications
Wafer capacity : 4in wafer or 100mm x 100mm glass
Dimension : 1,720L x 1,835H x 1,080W (mm3)
Power : AC 220V, single or three phase
Gas : Ar/N2/O2
Pump: Rotary pump & turbomolecular pump
Heater : SiC heater 6" (Max. 600'C)
Substrate bias : RF or DC
Loadlock system : single wafer loading or cassette loading
System control : LabView-based PC control
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Cho, Young Sang
- Address
- 175-25, Cheongcheon-Dong 2, Bupyeong-Gu, Incheon, 403-853, Rep. Korea
- Product Category
- Machinery & Parts
- Company introduction
-
Developed itmes
- Ion beam source
- Arc source
- Filtered cathodic vacuum arc system and process
- LPCVD for nanotube synthesis
- Silica PECVD system
- UHV(Ultra High Vacuum) sputtering system
- Silica TCP (Transformer Coupled Plasma) etcher
- UHV-sputter system for ferromagnetic multilayers
- Vacuum arc system for nitrides deposition
- In-line system of vacuum arc deposition for protecting PDP
electrodes
- High vacuum test system for a flat light source evaluation
- Multifunctional standard sputtering system for R&D
- NPPN(New Post Plasma Nitriding) System
- Sputter for polygon mirror applicable to laser printer
- Production scale of arc ion plating (AIP) system
- Ion beam sputter for precision optics
- Production scale of AIP and NPPN systems
- Ion plating system for various coloration
- Pilot scale of arc discharge equipment for CNT transparent electrode
sputter web coater for flexible display research
- Sputter system for ophthalmic
- Polycrystalline silicon ingot growing equipment
- PECVD system for anti-reflective coatings on solar cell
- PECVD system for graphene deposition
- Al plasma nitriding equipment for mass production with KAITECH
- Equipment of carbon nanotube using electrical arc discharge method
- Graphene PECVD-PVD Cluster equipment
- Main Product
