CMP Slurry Abrasive

In the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) is a technique used in semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer. In CMP process, the semiconductor substrate is polished by metal-oxide slurry using elastomer pad. According to the substrate, the process is consists of ILD, STI, and metal CMP. Generally, metal-oxide slurry for CMP is in need of stable dispersion, high removal rate, less defect such as scratch on the surface after polishing, high purity chemicals.

KONASIL is superior to this application for highly pure silicon dioxide, uniform particle size and proper size distribution.