Underfill Adhesive 5219

Underfill Adhesive 5219


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
Brand name
Lianbond
Payment Terms
Negotiable
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
adhesive, bonding chips, main board's filling, underfilled adhesive
Category
Industrial Supplies , Adhesives & Sealants

Shenzhen Prosper Dobond Technology Co., Ltd

Country / Year Established
China China /
Business type
Others
Verified Certificate

13

Product name Underfill Adhesive 5219 Certification -
Category Industrial Supplies
Adhesives & Sealants
Ingredients -
Keyword adhesive , bonding chips , main board's filling , underfilled adhesive Unit Size -
Brand name Lianbond Unit Weigh -
origin Stock -
Supply type - HS code -

Product Information

Underfill Adhesive:BGA Glue.Suitable for filling of Mobile Phone’s and Computer’s main board,filling for many other kinds of Electronic Components’ main board,also can be used for bonding and filling of Lens’s components and other electronic components.

5219 Underfill is a kind of one component,fast curing epoxy filling agent.Curing Temperature is 120℃,excellent liquidity,filling the gaps below 25 microns ,viscosity consistent,high flexibility and maintained performace.

Mainly for filling and protection after the CSP;BGA and UBGA’s assembly.Such as:Mobile Phone and laptop.

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

Shenzhen Prosper Dobond Technology Co., Ltd

Country / Year Established
China China /
Business type
Others

13

President
Liuhang
Address
Dingfeng Technology Park, Xiner Industrial Zone, Haosi Village, Shajing Town, Shenzhen City, Guangdong Province, China
Product Category
Adhesives & Sealants,Epoxy Adhesives,Industrial Supplies
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