Underfill Adhesive 5219
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Brand name
- Lianbond
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Category
- Industrial Supplies , Adhesives & Sealants
Shenzhen Prosper Dobond Technology Co., Ltd
- Country / Year Established
-
China
/
- Business type
- Others
- Verified Certificate
-
13
| Product name | Underfill Adhesive 5219 | Certification | - |
|---|---|---|---|
| Category |
Industrial Supplies
Adhesives & Sealants |
Ingredients | - |
| Keyword | adhesive , bonding chips , main board's filling , underfilled adhesive | Unit Size | - |
| Brand name | Lianbond | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Underfill Adhesive:BGA Glue.Suitable for filling of Mobile Phone’s and Computer’s main board,filling for many other kinds of Electronic Components’ main board,also can be used for bonding and filling of Lens’s components and other electronic components.
5219 Underfill is a kind of one component,fast curing epoxy filling agent.Curing Temperature is 120℃，excellent liquidity,filling the gaps below 25 microns ,viscosity consistent,high flexibility and maintained performace.
Mainly for filling and protection after the CSP;BGA and UBGA’s assembly.Such as:Mobile Phone and laptop.
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
Shenzhen Prosper Dobond Technology Co., Ltd
- Country / Year Established
-
China
/
- Business type
- Others
-
13
- President
- Liuhang
- Address
- Dingfeng Technology Park, Xiner Industrial Zone, Haosi Village, Shajing Town, Shenzhen City, Guangdong Province, China
- Product Category
- Adhesives & Sealants,Epoxy Adhesives,Industrial Supplies
- Main Product
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