Description : 

It is used as an ionic additive for copper plating in sulfate liquor as well as copper plating in acid solution for superior brightness at wide range of temperatures. It is mainly applicated in some fields requiring high-grade electroplating like science research, chemical reagent and IT industry. Copper sulphate of high purity can be used to effectively prevent the plating from varied problems since it could maximally avoid various metal contamination and organic impurities in plating bath in circuit wafer manufacturing.

Features :

Blue crystalline form, odourless, density:2.284g/cm3, dissolved in water and low concentration of acetic acid. It has a weak acid solution. It will effloresce slowly when exposed in dry air, and the surface will become white powder. It will lose four crystal water when heated to 110℃, and will be changed into anhydrous cupric sulfate of white color with water absorption when the temperature reaches to 150℃ or above.

Specification :     

CuSO4. 5H2O 99%Min

Cu 25.2%

Water insoluble 0.005% Max.

Ph value 3.5 -4.5

Cl 10 ppm Max.

Ni 5 ppm Max.

Cd 3 ppm Max.

Pb 10 ppm Max.

Fe 10 ppm Max.

Ca 5 ppm Max.

Zn 10 ppm Max.

Co 10 ppm Max.

As 5 ppm Max.

Other Description :  

Well and High Quality Control

Prompt Delivery

Competitive Prices

In a Variety of Designs

Plastic bag inside covered with woven bag of 25, 40 or 50 KGs net weight each.

Plastic bag inside covered with woven bag and BOPP film outside