Bluetooth Embedded module BoT-nLE523, 1:8 Multi , BLE secure connection
Bluetooth v5.3 / BLE / Slave, Master, 1:8 Multicon role / Class1.5 (+7dBm) / 3.3V UART / AT commmand / SIG, CE, FCC, JAPAN MIC, KC Cert
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- South Korea
- Brand name
- CHIPSEN
- Payment Terms
- T/T
- Production method
- OBM
- Shipping / Lead Time
- Negotiable / Negotiable
Chipsen Co., Ltd.
- Membership
- VIP
- Recent Visit
- Dec 16, 2024
- Country / Year Established
-
South Korea
/
2003
- Business type
- Manufacturer
- Verified Certificate
-
1
| Product name | Bluetooth Embedded module BoT-nLE523, 1:8 Multi , BLE secure connection | Certification | - |
|---|---|---|---|
| Category |
Other Electronic Telecoms
Wireless Networking Equipment |
Material | - |
| Keyword | embedded module , mass production , wireless communication equipment , data transfer | Unit Size | 8.0 * 15.0 * 1.8 mm |
| Brand name | CHIPSEN | Unit Weigh | 2 g |
| origin | South Korea | Stock | 1000 |
| Supply type | OBM | HS code | 8517 |
Product Information
CHIPSEN Bluetooth modules are designed for OEM and other applications requiring compact, high-performance Bluetooth communications solutions. The modules are available in Surface Mount (SMD) packages with integrated chip antennas for high-volume OEM applications, or for applications requiring automated assembly, low cost or small size. They are also offered in Dual In-Line Pin (DIP) packages with chip antennas ("D" packages), or with connectors for external U.FL ("DU" packages) and SMA antennas ("DS" packages)
If you create a wireless product using an uncertified module, you must obtain your own wireless certification. CHIPSEN Bluetooth modules already have multiple certifications (typically SIG, KC (including wireless EMC), FCC, CE and TELEC), reducing the cost and certification process of manufacturing your wireless products.
▪ Network Connectivity : Bluetooth Low Energy 5.3
▪ Feature : 1:8 Multi / BLE secure connection
▪ Role : Master / Slave / Multicon (1:8)
▪ TX Power : MAX +7dBm
▪ Beacon format: Beacon / iBeacon
▪ Current consumption : 0.007mA
▪ Dimension : 8 × 15 × 1.8 mm (W x L x H)
▪ Certification : SIG / CE / FCC / Japan MIC / KC
| Bluetooth Low Energy Module | |||
BoT-nLE521 | BoT-nLE521M | BoT-nLE523 | BoT-TMA50 | |
Pictures |
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Network Connectivity | Bluetooth Low Energy 5.0 | Bluetooth Low Energy 5.3 | ||
Feature | Cost-effective | 1:8 Multi BLE secure connection | 1:8 Multi Long range Bluetooth | |
Role | Slave | Master | Master / Slave / Multicon | Master / Slave / Multicon |
TX Power | MAX +4dBm | MAX +7dBm | MAX +20dBm | |
Beacon format | Beacon / iBeacon | |||
Current consumption | 0.007mA (Sleep) | |||
Dimension (W x L x H) | 8 × 15 × 1.8 mm | 13 × 19 × 2.4 mm | ||
Certification | SIG / CE / FCC / Japan MIC / KC | |||
B2B Trade
| Price (FOB) | Negotiable | transportation | Air Transportation,Express,Ocean Shipping |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | T/T | Shipping time | Negotiable |
- President
- IM JI HUN
- Address
- 501 M-CLUSTER , 17 Deogan-ro 104 beon-gil, Gwangmyeong-si, Gyeonggi-do, Korea
- Product Category
- Consumer Electronics,Electronic Data Systems,Wireless Networking Equipment
- Year Established
- 2003
- Company introduction
-
Hello, this is CHIPSEN a leading supplier of innovative Bluetooth modules and industrial communication devices in South Korea.
We aim to surpass all boundaries and connect the world with wireless technology.
We promise the best solution with our products using high-quality Bluetooth and wireless technology for your project.
- Main Markets
-
South Korea
Sweden
U.S.A
- Main Product
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_Battery_2.jpg "(S)TD410")
- Attached File
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