back grinding wheels are used for the thinning


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Required Quantity
Place of Origin
China
Brand name
Moresuperhard
Payment Terms
Others,T/T,Western Union
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
grinding wheels, back grinding wheels, are used for the thinning
Category
Abrasive Tools

Henan More Super Hard Products Co.,Ltd

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PRO
Country / Year Established
China China / 2014
Business type
Manufacturer
Verified Certificate

6

Product name back grinding wheels are used for the thinning Certification -
Category Abrasive Tools Ingredients -
Keyword grinding wheels , back grinding wheels , are used for the thinning Unit Size -
Brand name Moresuperhard Unit Weigh -
origin China Stock -
Supply type - HS code -

Product Information

 

name: diamond backgrinding wheel

application: silicon wafer

Details

Introduction of back grinding wheels:

Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.

During grinding, the grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis. The rotation axis for the grinding wheel is offset by a distance of the wheel radius relative to the rotation axis for the wafer.

 

Applications of back grinding wheels:

Back thinning, rough grinding and fine grinding of silicon wafer.

Workpiece processed include silicon wafer of discrete devices, integrated chips (IC) and virgin etc.

Advantages of back grinding wheels:

good Self-dressing ability, Long life and low prices.

high heat conductivity, high wear resistance, and low coefficient.

it is highly desirable that grinding wheels generate only very low damage to ground wafers.

Applicable grinding machine:

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

The Features of Back-side-Grinding-wheels:
1)Various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.
2) Stable manufactures technics. Provide with fine roughness of wafer surface.
3) Back Grinding wheel is the precision processing tool used in the process to grind unnecessary wafer back side and make the wafer back side with excellent backside roughness and uniform thickness, high technology is required to minimize wafer defect whose material is expensive and easy to be broken.

 

The specification of diamond back grinding wheels:

Model

Diameter (mm)

thickness (mm)

hole (mm)

 

6A2

175

30, 35

76

200

35

76

350

45

127

 

6A2T

195

22.5, 25

170

280

30

228.6

 

6A2T (three ellipses)

350

35

235

209

22.5

158

other size can ba made according to customers requirements

 

Our products Range:

 

1. vitrified bond/resin bond/Metal bond/Electroplated diamond grinding wheel & other diamond tools

2. PCD milling tools, pcd turning tools, pcd drilling tools, pcd engraving tools,pcd/pcbn inserts, pcd/pcbn cutting tools, pcd/pcbn grooving tools,CBN inserts

3. PCD/TSP diamond, CVD diamond tools, Natural diamond tools, diamond abrasive tools

4. diamond grinding&cutting discs, diamond cutting blade, diamond cup wheel, diamond dressers

5. Roller cutting tools, PDC cutters, pdc drill bits& pdc core bits

6. PCD tool grinder & pcd grinding machine

 

 

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Others,T/T,Western Union Shipping time Negotiable

Henan More Super Hard Products Co.,Ltd

Country / Year Established
China China / 2014
Membership
PRO
Business type
Manufacturer

6

President
Joe
Address
B906,Wanda Plaza, Zhongyuan Road, Zhengzhou, Henan, China
Product Category
Other Machinery Parts
Year Established
2014
Company introduction
"Henan More Super Hard Products Co.,Ltd" is specialized in manufacturing and marketing of diamond & CBN tools.
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