Prototype PCB Fabrication, Borderless Printed Circuit Boards PCBs,

6layer FR4 ROHS pcb board with ENIG
Type: 6layer
Laminate: FR4
Board thickness: 1.6MM
Surface finished: ENIG
Copper thickness: 35um (1oz)

Solder resist: green color
Silkcreen: white color 

Now we are better, stronger and solid and our service to offer and please our customers in all kinds of high Tech products and materials required and our standard is high to recon with.  Be it double-sided FR4 boards or single side, high technology, Blind and buried via boards, metal core boards, heavy copper boards, burn in boards or rigid-flex PCB and flex PCB. Etc.

We can bind and buried in all kinds of unique materials.

In developing series of high quality and a high standard material boards for suppliers and a full qualified component provider. We can also supply or furnish the electronic hobbyist or supply high quality PCB prototype at a low cost/ a good price.

Prototype PCB Fabrication & Prototype PCB Assembly Turn Time Prototype

We can offer a complete turnkey service for PCB prototyping: PCB Layout Design, PCB prototype fab, and PCB Assembly. Our circuit board prototyping services and turn times are unmatched:

By using fully qualified PCB manufacturing and Assembly facilities, we can provide printed boards（including HDI PCBs）as quickly as in 12 - 24 hours （depending on the technologies required）and assemble them within 24 hours.

Our professionals staff is here to serve our customers, assisting them to find the right Printed Circuit Boards solutions for their specific needs. By using our vast partners network, we can offer our customers Borderless Boards, providing them  all the printed circuit board technology and services. If you can’t find what you want, OR you are looking for an alternative partner, it’s time to contact the experts at MKTPCB.

Material type: High TG(tg180), FR4 ,CEM-1, Teflon, Ceramic, Polymide, Metal base and specific materials as requested (For example: Taconic, Arlon, Rogers

Surface finishing: HASL, Immersion Gold, Immersion Tin, ENIG, Electroless Silver, Selective gold plating, Electrolytic gold (Flash Gold). Soft gold, hard gold,(OSP)

Max. layer:  24 layers

Min. hole size:  0.2mm (8mil)

Min. hole tolerance: PTH +/- 3 mil, NPTH +/- 2 mil

Min Buried/Blind hole size :6 mil

Min Line width/spacing: 3 mil / 3 mil

Layer to layer registration: +/- 2 mil

Board thickness range:0.1 mm to 3.2 mm

Min SMT SM bridge: 0.1 mm (4 mil) 4oz (max) 0.5oz (min)

Max. Active Panel Size: 2 Layer 24”x28” Multilayer 22”x26”

Copper/Cladding Thickness Inner-layer: 6oz (max) 0.5oz (min) outer layer