KB 1686 M

KB 1686 M


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
India
Payment Terms
T/T
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
two component epoxy, superior mechanical strength, high purity nickel conductive epoxy adhesive sealant, high lap shear strength
Category
Epoxy Adhesives

Kohesi Bond

Membership
BIZ
Country / Year Established
India India / 2015
Business type
Manufacturer
Verified Certificate

7

Product name KB 1686 M Certification -
Category Epoxy Adhesives Ingredients -
Keyword two component epoxy , superior mechanical strength , high purity nickel conductive epoxy adhesive sealant , high lap shear strength Unit Size -
Brand name - Unit Weigh -
origin India Stock -
Supply type - HS code -

Product Information

Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1686 M offers a volume resistivity of 5 – 10 ohm-cm. It is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive serviceable temperature range of -50°C to +120°C. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 – 1.4 W/m/K), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE). Owing to its versatile performance, KB 1686 M is widely used in electronics, aerospace, electrical, semiconductor, microwave and many OEM applications. 

 

Packaging : Cans, Jars 

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options T/T Shipping time Negotiable

Kohesi Bond

Country / Year Established
India India / 2015
Membership
BIZ
Business type
Manufacturer

7

President
Utsav Shah
Address
209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S. Marg, Bhandup West, Mumbai - 400078
Product Category
Epoxy Adhesives
Year Established
2015
No. of Total Employees
51-100
Company introduction
<p>Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. In November 2014, we started prototyping as a part of an interdisciplinary effort with the Institute of Chemical Technology, bringing together a team of technical experts to formulate specialty adhesive systems. Through persistent research, technical know-how and groundbreaking innovation we were able to create new compounds that had truly distinguished properties. In September 2015, we founded Kohesi Bond to further our research and manufacture first-rate, industry-ready products in our state of the art facility.

To deliver reliable solutions, we realised that one size does not fit all. Hence, our focus has been on offering tailor-made products, consistent quality and unparalleled expertise to our customers. We want to keep innovating new products with diverse chemistries that add more value to every application. By researching, formulating and testing each product all under the same roof, we are able to take a holistic approach to manufacturing exclusive adhesives and provide customers with an end-to-end solution. 

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