KB 1039 CRLP-AO
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- India
- Payment Terms
- T/T
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- nasa low outgassing, two component epoxy, sealants and coatings for the aerospace industry, high thermal conductivity epoxy
- Category
- Epoxy Adhesives
Kohesi Bond
- Verified Certificate
-
7
Product name | KB 1039 CRLP-AO | Certification | - |
---|---|---|---|
Category | Epoxy Adhesives | Ingredients | - |
Keyword | nasa low outgassing , two component epoxy , sealants and coatings for the aerospace industry , high thermal conductivity epoxy | Unit Size | - |
Brand name | - | Unit Weigh | - |
origin | India | Stock | - |
Supply type | - | HS code | - |
Product Information
Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 – 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90°C for 3 – 5 hours.
KB 1039 CRLP-AO is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. Part A is black and Part B is off white in color. KB 1039 CRLP-AO is widely used in applications where thermal conductivity, low outgassing and cryogenic serviceability are key requirements.
Packaging : Cans, Pails
B2B Trade
Price (FOB) | Negotiable | transportation | - |
---|---|---|---|
MOQ | Negotiable | Leadtime | Negotiable |
Payment Options | T/T | Shipping time | Negotiable |
- President
- Utsav Shah
- Address
- 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S. Marg, Bhandup West, Mumbai - 400078
- Product Category
- Epoxy Adhesives
- Year Established
- 2015
- No. of Total Employees
- 51-100
- Company introduction
-
<p>Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. In November 2014, we started prototyping as a part of an interdisciplinary effort with the Institute of Chemical Technology, bringing together a team of technical experts to formulate specialty adhesive systems. Through persistent research, technical know-how and groundbreaking innovation we were able to create new compounds that had truly distinguished properties. In September 2015, we founded Kohesi Bond to further our research and manufacture first-rate, industry-ready products in our state of the art facility.
To deliver reliable solutions, we realised that one size does not fit all. Hence, our focus has been on offering tailor-made products, consistent quality and unparalleled expertise to our customers. We want to keep innovating new products with diverse chemistries that add more value to every application. By researching, formulating and testing each product all under the same roof, we are able to take a holistic approach to manufacturing exclusive adhesives and provide customers with an end-to-end solution.
- Main Product