MITCC (Mega Insulation Thermal Conductive Coat)

│Mega Insulation Thermal Conductive Coat (MITCC)│

• It is an insulation thermal conductive coating material that is converged with Sol-gel type organic/inorganic hybrid binder and super conductive graphene material. Thus, it has an merit of excellent insulation and thermal conductivity. It is new insulation thermal conductive coating material used for advanced printed circuit boards.
• First in the world, this coating material separates graphene film from impurities of oxide film, and it is easy to coat in thin graphene film type by spraying.
• It is a thin and ultra-light grapene coat material that does not require additional heat sink.
  The reason is that various printed circuit board and semiconductor mount package is directly coated by thermal conductive graphene material that fulfills both of high conductivity and insulation.

│The characteristics of MITCC│

• Chemical oxidizing separation type and spray type graphene MITCC for mass production
• Demonstrating over 30~100W/m.K of thermal conductivity only with 30um (0.03mm) spray.
• Key material for printing circuit board that requires both of high thermal conductivity and insulation
• Shielding function that can prevent electromagnetic wave inside and outside
• No biological violation and anti-corruption effect
• Able to coat metals, non-metals, plastics, FRP, carbon fabrics and fibers, films glass and so on

│Comparison : MITCC vs conventional heat-dissipation material│

• Need for Insulation and speedy heat-dissipation system

- 95% of conventional heat dissipation material is organic and inorganic compound.
- the temperature range of organic or organic/inorganic compound is below 300℃, and it is difficult to use in high temperature range.


• Need for simple system to construct the heat-dissipation structure

- conventional heat-dissipation material : difficult to attach to insulator as a film & pad type and to slim advanced material.
- attach type : less effect due to heat-dissipation structure of indirect transfer type.
- heat-dissipation system of attach type : difficult to realize various heat-dissipation structure like circular, linear, nonlinear, spiral

│Easy formation of thermal conductive layer│

• Stable MTCC over 400℃ with graphene
  
  - High stability in acid and alkali, high thermal stability material with graphene & ceramic
  - applied to metal, nonmetal, alloy, FRP, textile, glass, film and concrete
  
  
• Easy formation by spray coating method

- high bond-strength : 2MPa
- hardness : over 8H (Pencil hardness)
- Excellent effects for thermal dissipation from local-point heat-generation.
- various coating method : spray, Dipping, Roll coating

│Key tech. for thermal conductive material│

│Next-generation electronic devices and advanced material of graphene thermal conductive coat│

• Next-generation inorganic electronic device is thin, light, short, small and multifunctional but high
  density integration. Due to increase of heat density, the problem of thermal emission needs to be solved.
  Moreover, heat radiation system is an important factor because it is closely related to the reliability and
  lifetime of the device.
  
  
• Thermal conductive material of circuit board for high technology circuit board and a die attach and
  thermal spreader, high thermal conductive adhesive film and adhesive material, LED, rocket prepellants,
  car engines, marine engines, aircraft engines, gap filler radar, and all other require a solution to solve
  the heat problem of facility.
  
  
• Next-generation semiconductor package and high power LED package are experiencing low efficiency in
  active device and package destruction due to thermal stress. To solve this technical problem, the material
  of high thermal conductivity is needed to be developed urgently.

│The miniaturization and slimming of digital devices; the heat problem of IC, power and parts│

• Thermal conductive material is a core technology that highly influences the performance and lifetime of electronic devices.
• Due to rapid growth in demand for LED TV, the demand explosion for related materials is resulted.
  Thus, we are highly depending on imports of thermal conductive material.
• Because gold is used in the body of electronic devices, chassis and heat sink, the problem of heaviness and high price occurs.

│The market size and trend of thermal conductive materials│

• Market size : 11 hundred million dollars (2013) ? Ministry of Knowledge Economy
• The market size is rapidly growing due to the miniaturization and high performance of various devices.
• Highly depending on imports of high reliability boards and package from Japan
• Thermal conductive material is needed to be urgently developed for high efficient package used for semiconductor, automotive, LED, mobile, TV, computers, monitor and so on.

│The application of graphene thermal conductive coat│

• High thermal conductive material of circuit board:
  solved by coating LED lighting, LED head lamps, automotive, PCB circuit board
• High thermal conductive and thermoplastic package : solved by spraying instead of sheet type
• High thermal conductive adhesive material: solved by horizontally transferring heats of display parts
  (LCD, PDP, LED) and small IT devices

│Requirement of the application field and MTCC Tech│