R800C lead free hot air reflow oven controlled by the computer

(Upper is eight temperature zones and bottom is eight temperature zones)

Features
■Import heat spares, even temperature, high heat compensatory, so it is suitable for CSP, BGA and other components solder;
■Professional air wheel design, large air capacity and stable air speed;
■Every temperature zone is force independent cycle system, separate PID controlling; Heating of top and bottom zones are independent, that can make temperature more even and accuracy in the reflow oven;
■Quick warm up, it is ≤20 minutes from room to working temperature;
■Import motor which is high temperature and high speed, stable running, little noise and shaking;
■Double air cylinder lift devices(electric push rod) in the solder oven, safe and reliable;
■Chain and mesh transmission are synchronous and same speed; it is frequency adjustable speed;
■Good aluminum guide design, no deformation, automatic adding oil device on the chain;
■UPS power-off protection, it can make PCB out and not damage after cutting power;
■Strong software function which can monitor and measure temperature on PCBs; Analyze, saving and printing data profile;
■MODBUS contract  is used in Industrial PC and PLC communication; Stable running, no crash phenomenon;
■Automatic monitor and display device status; it can correct parameters at any time;
■Quick cool air change, even air speed, slope is frequency controlled, solder pad are smooth and bright;
■N2 flow meter is used to monitor N2 flow at any time;
■Quick oxygen output and nitrogen input, getting high purity nitrogen;