MIS Mill Etch
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- decap, decapsulation, decapsulator, semiconductor
- Category
- Other Machinery & Industry Equipment
MIS Co., Ltd.
- Verified Certificate
-
16
Product name | MIS Mill Etch | Certification | - |
---|---|---|---|
Category | Other Machinery & Industry Equipment | Ingredients | - |
Keyword | decap , decapsulation , decapsulator , semiconductor | Unit Size | - |
Brand name | - | Unit Weigh | - |
origin | Stock | - | |
Supply type | - | HS code | - |
Product Information
|
|
- Using End mill for the milling of EMC - Fast, safe, and accurate milling work - Prompt and accurate milling by robot motions (Average milling time < 1 min.) - Robot motion (X, Y, Z axis) having the precision of minimum 0.01mm (10㎛) - Automatically recognizing the height of the sample surface through a sensor and doing the milling work - Providing various sizes of end mills (Φ1.0, Φ2.0, Φ3.0 mm) - Very effective for the removal of metal surface - Reducing the molding (EMC) thickness, which makes the decapsulation work finished fast - Providing the guide well for etching zones - Backside milling which is effective for removing PCB and molding |
B2B Trade
Price (FOB) | Negotiable | transportation | - |
---|---|---|---|
MOQ | Negotiable | Leadtime | Negotiable |
Payment Options | Negotiable | Shipping time | Negotiable |
- President
- SHIN KYEONG WOOK
- Address
- #709, Daehyun Techno World 174, Ojeon-dong, Uiwang-si, Gyeonggi-do
- Product Category
- Plastic Product Making Machinery
- No. of Total Employees
- over 2000
- Company introduction
-
MIS Co., Ltd. is a Manufacturing Company producing Semiconductor tester machines. We developed a Encapsulation Machine, Which removes automatically EMC(Epoxy Molding Compound) of Packaged semiconductor chips without any damage of wire bonds. When the examined packaged chip is judged to have defects, the Encapsulation process determines the defects in a semiconductor whether it was blemished in the packaging process or the wafer process. Our Decipher Machines makes it possible to open the packaged chip quickly and it automates the whole process of opening the failed chip. - Computer GUI All the functions and operations are controlled by Graphic User interface using Computer. - Accuracy 0.01mm Milling Accuracy of the milling depth. MIS auto Decipher detects the height automatically using sensor. MIS Auto Decipher can test various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm. - Convenient Operation User can easily find and use a best automatic process using recipe files stored in a database. User can easily create new recipe and edit it. Milling, Chemical process, Cleaning, Inspection, Storing of digital images, Checking of Machine settings or errors can be easily executed by GUI. - Safety MIS Auto Decipher secures the safety from the acid gas evaporation using gas exhauster and it use the minimum chemicals. - Dispensing MIS Auto Decipher has a special pump, which can inject Fuming Nitric Acid, Fuming Sulfuric Acid or Sulfuric Acid by 0.005cc(Min.) to remove the Epoxy Molding Compound of a chip. - Various Handling IC MIS Auto Decipher uses various chemical dosing methods and this makes it possible to decamp various package types such as BGA, DIP, QFP, CSP, TSOP, PBGA, Most of package types. - Speedy process MIS Auto Decipher can remove the EMC of various chips faster than before. Usually BGA type takes tome not more than 20 minutes and NON-BGA type can be executed within 15 minutes. - No Need of Gasket MIS Auto Decip
- Main Product