MIS Mill Etch

MIS Mill Etch


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
Payment Terms
Negotiable
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
decap, decapsulation, decapsulator, semiconductor
Category
Other Machinery & Industry Equipment

MIS Co., Ltd.

Membership
VIP
Country / Year Established
South Korea South Korea /
Business type
Others
Verified Certificate

16

DUNS

Product name MIS Mill Etch Certification -
Category Other Machinery & Industry Equipment Ingredients -
Keyword decap , decapsulation , decapsulator , semiconductor Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -

Product Information

# Function & Features
 
- Using End mill for the milling of EMC
- Fast, safe, and accurate milling work
- Prompt and accurate milling by robot motions (Average   milling time < 1 min.)
- Robot motion (X, Y, Z axis) having the precision of minimum   0.01mm (10㎛)
- Automatically recognizing the height of the sample surface   through a sensor and doing the milling work
- Providing various sizes of end mills (Φ1.0, Φ2.0, Φ3.0 mm)
- Very effective for the removal of metal surface
- Reducing the molding (EMC) thickness, which makes the   decapsulation work finished fast
- Providing the guide well for etching zones
- Backside milling which is effective for removing PCB and
  molding

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

MIS Co., Ltd.

Country / Year Established
South Korea South Korea /
Membership
VIP
Business type
Others

16

DUNS

President
SHIN KYEONG WOOK
Address
#709, Daehyun Techno World 174, Ojeon-dong, Uiwang-si, Gyeonggi-do
Product Category
Plastic Product Making Machinery
No. of Total Employees
over 2000
Company introduction
MIS Co., Ltd. is a Manufacturing Company producing Semiconductor tester machines. We developed a Encapsulation Machine, Which removes automatically EMC(Epoxy Molding Compound) of Packaged semiconductor chips without any damage of wire bonds. When the examined packaged chip is judged to have defects, the Encapsulation process determines the defects in a semiconductor whether it was blemished in the packaging process or the wafer process. Our Decipher Machines makes it possible to open the packaged chip quickly and it automates the whole process of opening the failed chip. - Computer GUI All the functions and operations are controlled by Graphic User interface using Computer. - Accuracy 0.01mm Milling Accuracy of the milling depth. MIS auto Decipher detects the height automatically using sensor. MIS Auto Decipher can test various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm. - Convenient Operation User can easily find and use a best automatic process using recipe files stored in a database. User can easily create new recipe and edit it. Milling, Chemical process, Cleaning, Inspection, Storing of digital images, Checking of Machine settings or errors can be easily executed by GUI. - Safety MIS Auto Decipher secures the safety from the acid gas evaporation using gas exhauster and it use the minimum chemicals. - Dispensing MIS Auto Decipher has a special pump, which can inject Fuming Nitric Acid, Fuming Sulfuric Acid or Sulfuric Acid by 0.005cc(Min.) to remove the Epoxy Molding Compound of a chip. - Various Handling IC MIS Auto Decipher uses various chemical dosing methods and this makes it possible to decamp various package types such as BGA, DIP, QFP, CSP, TSOP, PBGA, Most of package types. - Speedy process MIS Auto Decipher can remove the EMC of various chips faster than before. Usually BGA type takes tome not more than 20 minutes and NON-BGA type can be executed within 15 minutes. - No Need of Gasket MIS Auto Decip
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